Chiplet and 3D packaging are advanced semiconductor design techniques that break down large chips into smaller chiplets and stack them for better performance, efficiency, and cost-effectiveness. These methods overcome the limits of traditional chip scaling (Moore’s Law) and are ideal for AI, smartphones, data centers, and autonomous systems.
Key benefits include high performance, lower manufacturing costs, modular design flexibility, better power efficiency, and faster time-to-market. Industry leaders like Intel, AMD, TSMC, and Samsung, along with startups such as Lightmatter and Tenstorrent, are driving innovation in this space.
With over 3,700 patents across 66 countries, the technology is highly mature and supported by global R&D. Emerging standards like UCIe and IEEE 1838 are ensuring compatibility and scalability. Chiplet and 3D packaging are set to power the next wave of smarter, greener electronics.
