Advanced Packaging & 3D integration

Advanced semiconductors combine chiplet architectures, 2.5D/3D packaging, and system-level co-design to overcome the cost, yield, and power limits of monolithic chips. By disaggregating compute, memory, and I/O into modular tiles and integrating them with high-bandwidth interconnects, these technologies enable scalable performance, faster time-to-market, and improved energy efficiency. They are foundational to AI, cloud computing, automotive, and next-generation networking, with strong industry investment, maturing standards, and active patent activity driving widespread commercial adoption.